US 12,404,438 B2
Thermally conductive board
Kuo-Chang Lo, New Taipei (TW)
Assigned to TCLAD TECHNOLOGY CORPORATION, Miaoli County (TW)
Filed by Polytronics Technology Corp., Hsinchu (TW)
Filed on Jul. 6, 2023, as Appl. No. 18/348,001.
Claims priority of application No. 111148124 (TW), filed on Dec. 15, 2022.
Prior Publication US 2024/0199936 A1, Jun. 20, 2024
Int. Cl. C09K 5/14 (2006.01); C08J 5/04 (2006.01); C08K 3/36 (2006.01); H05K 1/03 (2006.01); C08K 3/34 (2006.01)
CPC C09K 5/14 (2013.01) [C08J 5/043 (2013.01); C08K 3/36 (2013.01); H05K 1/0373 (2013.01); C08J 2327/18 (2013.01); C08J 2327/22 (2013.01); C08K 2003/343 (2013.01); C08K 2201/001 (2013.01); H05K 2201/015 (2013.01); H05K 2201/0209 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A thermally conductive board, comprising:
a top metal foil;
a bottom metal foil; and
a thermally conductive layer being electrically insulative, and laminated between the top metal foil and the bottom metal foil, wherein the thermally conductive layer comprises:
an electrically insulation matrix comprising a fluoropolymer; and
a thermally conductive filler comprising a glass fiber dispersed in the electrically insulation matrix, wherein the glass fiber has:
a first dielectric constituent being a halogen, wherein the total weight of the glass fiber is calculated as 100%, and the halogen accounts for at least 0.05% by weight of the glass fiber; and
a second dielectric constituent being a titanium family element, wherein the total weight of the glass fiber is calculated as 100%, and the titanium family element accounts for at least 0.03% by weight of the glass fiber.