	US 12,404,405 B2
	Thermally conductive composite and a method for preparing the same
Takanori Ito, Annaka (JP); and Akihiro Endo, Annaka (JP)
Assigned to Shin-Etsu Chemical Co., Ltd., Tokyo (JP)
Appl. No. 17/604,871
Filed by Shin-Etsu Chemical Co., Ltd., Tokyo (JP)
PCT Filed Apr. 20, 2020, PCT No. PCT/JP2020/017042 § 371(c)(1), (2) Date Oct. 19, 2021, PCT Pub. No. WO2020/218235, PCT Pub. Date Oct. 29, 2020.
Claims priority of application No. 2019-082836 (JP), filed on Apr. 24, 2019.
Prior Publication US 2022/0220311 A1, Jul. 14, 2022
Int. Cl. C08L 83/04 (2006.01); C08K 3/08 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 5/14 (2006.01); C08K 5/541 (2006.01); C09J 7/38 (2018.01); C09J 183/00 (2006.01)

CPC C08L 83/04 (2013.01) [C08K 3/08 (2013.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 5/14 (2013.01); C08K 5/541 (2013.01); C09J 7/38 (2018.01); C09J 183/00 (2013.01); C09J 2301/408 (2020.08); C09J 2479/086 (2013.01); C09J 2483/00 (2013.01)]

20 Claims

1. A thermally conductive composite comprising a first thermally conductive adhesive layer, a reinforcing layer (A) layered on one surface of the first thermally conductive adhesive layer, and a second thermally conductive adhesive layer layered on a free surface of the reinforcing layer (A),

wherein the first and second thermally conductive adhesive layers comprise, independently of each other, a silicone composition consisting of the following components (a) to (e) and optional additives selected from the group consisting of surface treatment agents, pigments, dyes, and flame retardants:

100 parts by mass of (a) linear or branched organopolysiloxane,

1,000 to 3,000 parts by mass of (b) thermally conductive filler,

100 to 500 parts by mass of (c) silicone resin,

1 to 10 parts by mass of (d) organohydrogenpolysiloxane, and

0.5 to 5 parts by mass of (e) organic peroxide.