US 12,404,386 B2
Cured epoxy resin composition suitable for electronic device enclosure, articles, and methods
Brett A. Beiermann, St. Paul, MN (US); John C. Clark, Maplewood, MN (US); Eric G. Larson, Lake Elmo, MN (US); Jeremy M. Higgins, Roseville, MN (US); Audrey S. Forticaux, Minneapolis, MN (US); Jay R. Lomeda, St. Paul, MN (US); Wayne S. Mahoney, St. Paul, MN (US); Scott B. Charles, Spring Valley, WI (US); Timothy D. Fletcher, Lino Lakes, MN (US); Wendy L. Thompson, Roseville, MN (US); and Kyle R. Schwartz, Maplewood, MN (US)
Assigned to 3M Innovative Properties Company, St. Paul, MN (US)
Filed by 3M INNOVATIVE PROPERTIES COMPANY, St. Paul, MN (US)
Filed on Aug. 8, 2023, as Appl. No. 18/366,753.
Application 18/366,753 is a continuation of application No. 16/756,518, granted, now 11,773,254, previously published as PCT/US2018/067091, filed on Dec. 21, 2018.
Claims priority of provisional application 62/610,639, filed on Dec. 27, 2017.
Prior Publication US 2023/0383114 A1, Nov. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. C08K 3/22 (2006.01); C08K 3/14 (2006.01); C08K 3/38 (2006.01); C08K 7/20 (2006.01); C08L 63/00 (2006.01)
CPC C08K 3/22 (2013.01) [C08K 3/14 (2013.01); C08K 3/38 (2013.01); C08K 7/20 (2013.01); C08L 63/00 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/009 (2013.01)] 18 Claims
 
1. An electronic device selected from a phone, tablet, laptop, or mouse comprising a housing or case that comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles; wherein the cured epoxy resin composition has a thermal conductivity of at least 1 W/m*K and is radio frequency transparent such that the cured epoxy resin composition has a dielectric loss tangent <0.03 ranging from 104 to 1010 Hz.