US 12,404,363 B2
Epoxy resin composition and cured product of same
Natsumi Nishimoto, Kanagawa (JP); and Kazuki Kouno, Kanagawa (JP)
Assigned to MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
Appl. No. 18/857,756
Filed by MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo (JP)
PCT Filed Apr. 6, 2023, PCT No. PCT/JP2023/014174
§ 371(c)(1), (2) Date Oct. 17, 2024,
PCT Pub. No. WO2023/210284, PCT Pub. Date Nov. 2, 2023.
Claims priority of application No. 2022-071789 (JP), filed on Apr. 25, 2022.
Prior Publication US 2025/0171581 A1, May 29, 2025
Int. Cl. C08G 59/50 (2006.01); C08G 59/18 (2006.01); C08L 61/18 (2006.01); C08L 63/00 (2006.01)
CPC C08G 59/50 (2013.01) [C08G 59/184 (2013.01); C08L 61/18 (2013.01); C08L 63/00 (2013.01)] 6 Claims
 
1. An epoxy resin composition comprising:
an epoxy resin (A);
an epoxy resin curing agent (B);
a solvent (C); and
an aromatic hydrocarbon formaldehyde resin (D),
wherein:
a mass ratio of a total content of component (C) and component (D) to a total content of components (B), (C), and (D), [(C+D)/(B+C+D)], is from 0.42 to 0.57, and the mass ratio of component (C) to component (D), C/D, is 1.00 or more;
a content of the epoxy resin (A) is 30 to 70 mass % and a content of the epoxy resin curing agent (B) is 5 to 50 mass % in the epoxy resin composition;
the epoxy resin curing agent (B) comprises a reaction composition comprising a reaction product of a polyamine compound represented by the following formula (1) and an epoxy compound having at least one epoxy group:
H2N—CH2—A—CH2—NH2  (1)
wherein A is a phenylene group or a cyclohexylene group; and
the epoxy compound having at least one epoxy group comprises an epoxy compound containing an aromatic ring or an alicyclic structure in the molecule.