US 12,404,206 B2
Method for manufacturing ultra-thin glass substrates and method for manufacturing display panel
Hao-Yu Chou, Bozhou (CN); Cheng-Chung Chiang, Bozhou (CN); Tian-Ming Wu, Bozhou (CN); Chun-Chieh Huang, Bozhou (CN); and Feng Chen, Bozhou (CN)
Assigned to Flexi Glass Co., Ltd., Bozhou (CN)
Appl. No. 18/036,710
Filed by Flexi Glass Co.,Ltd., Bozhou (CN)
PCT Filed Apr. 12, 2021, PCT No. PCT/CN2021/086425
§ 371(c)(1), (2) Date May 12, 2023,
PCT Pub. No. WO2022/110610, PCT Pub. Date Jun. 2, 2022.
Claims priority of application No. 202011344817.2 (CN), filed on Nov. 26, 2020.
Prior Publication US 2023/0406757 A1, Dec. 21, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. C03C 15/00 (2006.01)
CPC C03C 15/00 (2013.01) 9 Claims
OG exemplary drawing
 
1. A method for manufacturing ultra-thin glass substrates comprising the following steps:
S510: providing a glass base material preset with n substrate areas and a skeleton area surrounding the substrate areas, wherein n is greater than or equal to 1;
S520: at least forming an etching protection layer on each of an upper surface and a lower surface of each substrate area of the glass base material, respectively, wherein, each etching protection layer comprises a main area and at least one thinned area extending along a preset bending path;
S530: at least etching the skeleton area of the glass base material to separate the substrate areas from the glass base material, forming at least one bending stress dissipation groove extending along the preset bending path on each substrate area through the thinned area, and forming a stress dissipation edge along an edge of each substrate area;
S540: removing the etching protection layer to get independent glass substrates having the bending stress dissipation groove;
wherein, the step S520 comprises the following steps:
S521: forming a polymeric reinforcing layer on at least one side of the upper surface and the lower surface of each substrate area of the glass base material, wherein the polymeric reinforcing layer comprises a slit, components of the polymeric reinforcing layer comprise acrylic, organic polymer material containing silicon, epoxy resin, fluororesin, polyamide, polyimide, polycarbonate, polyethylene terephthalate and poly-1,4-cyclohexanedimethyl terephthalate;
S522: forming an etching protection layer on one side of the polymeric reinforcing layer away from each substrate area, the etching protection layer having at least one narrow slit exposing a part of each substrate area, a projection of the narrow slit of the polymeric reinforcing layer coinciding with a projection of the narrow slit of the etching protection layer on the substrate area.
 
9. A method for manufacturing ultra-thin glass substrates comprising the following steps:
S510: providing a glass base material preset with n substrate areas and a skeleton area surrounding the substrate areas, wherein n is greater than or equal to 1;
S520: at least forming an etching protection layer on each of an upper surface and a lower surface of each substrate area of the glass base material, respectively, wherein, each etching protection layer comprises a main area and at least one thinned area extending along a preset bending path;
S530: at least etching the skeleton area of the glass base material to separate the substrate areas from the glass base material, forming at least one bending stress dissipation groove extending along the preset bending path on each substrate area through the thinned area, and forming a stress dissipation edge along an edge of each substrate area;
S540: removing the etching protection layer to get independent glass substrates having the bending stress dissipation groove;
wherein the step S520 comprises the following steps:
S523: forming a panel function layer on at least one side of the upper surface and the lower surface of each substrate area of the glass base material, the panel function layer having a narrow slit, wherein the panel function layer comprises one of a TFT rear panel, an organic light emitting layer, a touch detection layer, a fingerprint identification laver, and a cover plate or a combination thereof;
S524: forming the etching protection layer on one side of the panel function layer away from each substrate area, the etching protection layer having at least one narrow slit exposing a part of each substrate area, a projection of the narrow slit of the panel function layer coinciding with a projection of the narrow slit of the etching protection layer on the substrate area.