US 12,404,168 B2
MEMS device
Qin Shi, Nanjing (CN); Qifang Hu, Shenzhen (CN); Anping Qiu, Nanjing (CN); and Jinghui Xu, Shenzhen (CN)
Assigned to HUAWEI TECHNOLOGIES CO., LTD., Shenzhen (CN)
Filed by HUAWEI TECHNOLOGIES CO., LTD., Guangdong (CN)
Filed on Jan. 30, 2023, as Appl. No. 18/161,310.
Application 18/161,310 is a continuation of application No. PCT/CN2021/108477, filed on Jul. 26, 2021.
Claims priority of application No. 202010761268.2 (CN), filed on Jul. 31, 2020.
Prior Publication US 2023/0174371 A1, Jun. 8, 2023
Int. Cl. B81B 7/00 (2006.01); B81C 1/00 (2006.01)
CPC B81B 7/0048 (2013.01) [B81C 1/00888 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01)] 14 Claims
OG exemplary drawing
 
1. A micro electro mechanical system (MEMS) device, wherein the MEMS device comprises: a package, a bottom plate, and a first inertial component;
the bottom plate and the package form a packaging space between the bottom plate and the package, and the first inertial component is located in the packaging space; and
there is a first alignment part on a surface that is of the bottom plate and that faces the packaging space, the first inertial component has a first mounting part, a shape of the first mounting part matches a shape of the first alignment part, the first mounting part is connected to the first alignment part to mount the first inertial component on the bottom plate at a preset angle, and the preset angle is greater than 0 degrees and less than 180 degrees.