US 12,403,711 B2
Laminate, card, and housing
Maho Watanabe, Tokyo (JP); Hirohisa Amago, Tokyo (JP); Yuriko Kaino, Tokyo (JP); Kenji Takagi, Tokyo (JP); Ryota Yamano, Tokyo (JP); Hiroshi Mizuno, Tokyo (JP); and Aya Tejima, Tokyo (JP)
Assigned to Sony Group Corporation, Tokyo (JP)
Appl. No. 18/268,882
Filed by Sony Group Corporation, Tokyo (JP)
PCT Filed Dec. 22, 2021, PCT No. PCT/JP2021/047702
§ 371(c)(1), (2) Date Jun. 21, 2023,
PCT Pub. No. WO2022/138766, PCT Pub. Date Jun. 30, 2022.
Claims priority of application No. 2020-212981 (JP), filed on Dec. 22, 2020.
Prior Publication US 2024/0042784 A1, Feb. 8, 2024
Int. Cl. B41M 5/42 (2006.01); B41M 5/323 (2006.01); B41M 5/41 (2006.01); B41M 5/44 (2006.01); B41M 5/46 (2006.01); B42D 25/41 (2014.01); B41M 5/327 (2006.01); B41M 5/333 (2006.01); B41M 5/34 (2006.01); B42D 25/23 (2014.01)
CPC B41M 5/42 (2013.01) [B41M 5/323 (2013.01); B41M 5/41 (2013.01); B41M 5/46 (2013.01); B42D 25/41 (2014.10); B41M 5/3275 (2013.01); B41M 5/3335 (2013.01); B41M 5/34 (2013.01); B41M 5/44 (2013.01); B41M 2205/04 (2013.01); B41M 2205/38 (2013.01); B41M 2205/42 (2013.01); B42D 25/23 (2014.10)] 16 Claims
OG exemplary drawing
 
1. A laminate comprising:
a base material;
a first intermediate layer provided on the base material and having an accommodation part;
a recording medium provided in the accommodation part; and
an overlay layer provided on the first intermediate layer, wherein
the accommodation part is provided in a part of a plane of the first intermediate layer,
the accommodation part is a through hole penetrating in a thickness direction of the first intermediate layer or a recess recessed in a thickness direction of the first intermediate layer,
the recording medium includes a color development layer containing: a coloring compound having an electron donating property; a developer having an electron accepting property; and a matrix resin,
the base material, the first intermediate layer, and the overlay layer contain a resin material including a polycarbonate-based resin, and
the base material and the first intermediate layer are bonded to each other by fusion, and the first intermediate layer and the overlay layer are bonded to each other by fusion.