US 12,403,685 B2
Plate cooling device and de-bonding station with plate cooling device
Jung-Hua Chang, Hsinchu County (TW); and Ta-Hao Kuo, Hsinchu County (TW)
Assigned to SKY TECH INC., Hsinchu (TW)
Filed by SKY TECH INC., Hsinchu County (TW)
Filed on Sep. 26, 2023, as Appl. No. 18/373,266.
Prior Publication US 2025/0100267 A1, Mar. 27, 2025
Int. Cl. B32B 43/00 (2006.01)
CPC B32B 43/006 (2013.01) [Y10T 156/1153 (2015.01); Y10T 156/1911 (2015.01)] 9 Claims
OG exemplary drawing
 
1. A de-bonding station, for stripping a wafer from a carrier plate, comprising:
a base with two guiding pieces on two opposite edge sides;
a carrier device disposed on the base and located between the two guiding pieces; wherein the carrier device comprises:
a holder for the wafer and the carrier plate to be placed thereon; wherein a de-bonding section is provided on a top surface of the holder for placing the wafer and the carrier plate, and carrier plate is located above the wafer,
a vacuum chuck provided in the de-bonding section for vacuum absorbing the wafer;
a plurality of lifting pins, disposed in the de-bonding section in a rising and lowering manner, and able to lower and fully embed in the holder, or rise to push up or accept the wafer;
a plate cooling device, disposed on the base, and located between the two guiding pieces, comprising:
a cooling plate including an upper surface; and
a plurality of contact pads disposed on the upper surface; wherein the contact pads protrude on the upper surface, and the total area of the contact pads is less than 3% of the area of the carrier plate projected on the upper surface; and
a carrier plate pickup device comprising a movable seat and a pickup head; wherein the movable seat is movably coupled to the two guiding pieces; the pickup head is movably disposed on the movable seat for vacuum adsorbing the carrier plate, so as to strip the carrier plate from the wafer and move the carrier plate to a cooling area of the plate cooling device.