US 12,403,676 B2
Thin-film devices and fabrication
Fabian Strong, Hayward, CA (US); Yashraj Bhatnagar, Santa Clara, CA (US); Abhishek Anant Dixit, Collierville, TN (US); Todd Martin, Mountain View, CA (US); and Robert T. Rozbicki, Saratoga, CA (US)
Assigned to View Operating Corporation, San Jose, CA (US)
Filed by View, Inc., Milpitas, CA (US)
Filed on Aug. 31, 2021, as Appl. No. 17/446,566.
Application 17/446,566 is a continuation of application No. 16/947,834, filed on Aug. 19, 2020, granted, now 11,559,970.
Application 16/947,834 is a continuation of application No. 15/491,869, filed on Apr. 19, 2017, granted, now 10,795,232, issued on Oct. 6, 2020.
Application 15/491,869 is a continuation of application No. 14/822,732, filed on Aug. 10, 2015, granted, now 10,114,265, issued on Oct. 30, 2018.
Application 14/822,732 is a continuation of application No. 14/362,863, granted, now 9,454,053, issued on Sep. 27, 2016, previously published as PCT/US2012/068817, filed on Dec. 10, 2012.
Claims priority of provisional application 61/709,046, filed on Oct. 2, 2012.
Claims priority of provisional application 61/664,638, filed on Jun. 26, 2012.
Claims priority of provisional application 61/569,716, filed on Dec. 12, 2011.
Prior Publication US 2021/0394489 A1, Dec. 23, 2021
Int. Cl. B32B 17/10 (2006.01); C23C 14/08 (2006.01); G02B 1/18 (2015.01); G02F 1/1523 (2019.01); G02F 1/153 (2006.01); G02F 1/155 (2006.01); H01B 13/00 (2006.01)
CPC B32B 17/10119 (2013.01) [B32B 17/10513 (2013.01); B32B 17/1099 (2013.01); C23C 14/086 (2013.01); G02B 1/18 (2015.01); G02F 1/1523 (2013.01); G02F 1/1533 (2013.01); G02F 1/155 (2013.01); H01B 13/00 (2013.01); G02F 1/153 (2013.01); G02F 2001/1536 (2013.01); Y10T 29/49126 (2015.01)] 14 Claims
OG exemplary drawing
 
1. A method of cutting an optical device laminate, the method comprising, in order:
receiving an optical device assembly comprising a first substrate with a plurality of electrochromic stacks disposed thereon;
testing at least some of the plurality of electrochromic stacks to find defects;
mitigating at least some of the found defects;
laminating a second substrate onto the first substrate to form an optical device laminate; and
cutting, using a laser, the optical device laminate into a plurality of optical device lites.