US 12,403,627 B2
Method for cutting substrate elements
Melodie Chaperon, Grenoble (FR); William Halliday, Edinburgh (GB); and Jean Gagnieux, Montaud (FR)
Assigned to STMicroelectronics (Grenoble 2) SAS, Grenoble (FR); and STMicroelectronics (Research & Development) Limited, Marlow (GB)
Filed by STMicroelectronics (Grenoble 2) SAS, Grenoble (FR); and STMicroelectronics (Research & Development) Limited, Marlow (GB)
Filed on Mar. 22, 2023, as Appl. No. 18/124,834.
Claims priority of application No. 2202556 (FR), filed on Mar. 23, 2022.
Prior Publication US 2023/0302683 A1, Sep. 28, 2023
Int. Cl. B28D 5/00 (2006.01); B28D 5/04 (2006.01)
CPC B28D 5/0082 (2013.01) [B28D 5/0052 (2013.01); B28D 5/04 (2013.01)] 22 Claims
OG exemplary drawing
 
1. A method, comprising:
providing a plurality of substrate elements, wherein each substrate element has a first side and a second side meeting at a corner point;
picking and placing the plurality of substrate elements on a support device to be aligned with each other; and
cutting each of the plurality of substrate elements along a first cut line having a first direction common to the plurality of substrate elements and intersecting the first and second sides of each substrate element in order to create a third side on each substrate element, wherein the third side of each substrate element meets the first and the second sides at corresponding corner points.