US 12,403,500 B2
Substrate processing with polymer-containing liquid
Yukifumi Yoshida, Kyoto (JP); Yu Yamaguchi, Kyoto (JP); and Song Zhang, Kyoto (JP)
Assigned to SCREEN Holdings Co., Ltd., Kyoto (JP)
Appl. No. 18/550,643
Filed by SCREEN Holdings Co., Ltd., Kyoto (JP)
PCT Filed Jan. 17, 2022, PCT No. PCT/JP2022/001426
§ 371(c)(1), (2) Date Sep. 14, 2023,
PCT Pub. No. WO2022/196071, PCT Pub. Date Sep. 22, 2022.
Claims priority of application No. 2021-046459 (JP), filed on Mar. 19, 2021; and application No. 2021-211618 (JP), filed on Dec. 24, 2021.
Prior Publication US 2024/0165657 A1, May 23, 2024
Int. Cl. B05D 1/00 (2006.01); B05D 3/02 (2006.01); B05D 3/10 (2006.01)
CPC B05D 1/005 (2013.01) [B05D 3/0254 (2013.01); B05D 3/10 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A substrate processing method comprising:
supplying, to a major surface of a substrate, a polymer-containing liquid that contains an acidic polymer and a solvent dissolving the acidic polymer;
rotating the substrate to coat and solidify the polymer-containing liquid so as to form a polymer film containing the acidic polymer, on the major surface of the substrate;
by use of the acidic polymer in the polymer film, pulling a metal foreign matter adhered to the major surface of the substrate away from the major surface of the substrate and adsorbing the foreign matter by the polymer film; and
supplying, to the major surface of the substrate, a rinse liquid that cleans the major surface of the substrate on which the polymer film is formed.