US 12,075,650 B2
Display device and method for manufacturing the same
Myoung-ha Jeon, Asan-si (KR); Jinho Kim, Daegu (KR); Hyeonjeong Oh, Yeosu-si (KR); and Kichang Lee, Gwacheon-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-do (KR)
Filed by Samsung Display Co., Ltd., Yongin-si (KR)
Filed on Oct. 17, 2021, as Appl. No. 17/503,348.
Application 17/503,348 is a division of application No. 16/245,431, filed on Jan. 11, 2019, granted, now 11,152,595.
Claims priority of application No. 10-2018-0005247 (KR), filed on Jan. 15, 2018.
Prior Publication US 2022/0102682 A1, Mar. 31, 2022
Int. Cl. H10K 50/844 (2023.01); G03F 7/00 (2006.01); G03F 7/028 (2006.01); G03F 7/095 (2006.01); G03F 7/20 (2006.01); G03F 7/24 (2006.01); G09F 9/30 (2006.01); H10K 71/00 (2023.01); H10K 77/10 (2023.01); H10K 102/00 (2023.01)
CPC H10K 50/8445 (2023.02) [G03F 7/0007 (2013.01); G03F 7/028 (2013.01); G03F 7/095 (2013.01); G03F 7/202 (2013.01); G03F 7/24 (2013.01); G09F 9/301 (2013.01); H10K 71/00 (2023.02); H10K 77/111 (2023.02); H10K 2102/311 (2023.02)] 8 Claims
OG exemplary drawing
 
1. A display device comprising:
a flexible substrate comprising:
a display area; and
a non-display area disposed on at least one side of the display area and comprising a bending part;
a display panel disposed on the display area;
a polarization plate disposed on the display panel;
a protection layer disposed on the non-display area and having a modulus value of 500 MPa to 1,200 Mpa; and
a connection circuit member disposed on the non-display area and electrically connected to the display panel,
wherein:
the protection layer does not contact the polarization plate,
the protection layer is disposed between the display panel and the connection circuit member to overlap a portion of at least one of the display panel or the connection circuit member; and
a thickness of a central portion of the protection layer is greater than a thickness of a portion of the protection layer adjacent to, and not overlapping an upper surface of, the display panel and a thickness of a portion of the protection layer adjacent to, and not overlapping a lower surface of, the connection circuit member.