US 12,075,605 B2
Electronic component with internal shielding
Teppo Syrjänen, Helsinki (FI); Ville-Pekka Rytkönen, Klaukkala (FI); and Reijo Rautakoski, Espoo (FI)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed on Jan. 10, 2022, as Appl. No. 17/572,073.
Claims priority of application No. 20215121 (FI), filed on Feb. 4, 2021.
Prior Publication US 2022/0248576 A1, Aug. 4, 2022
Int. Cl. H05K 9/00 (2006.01)
CPC H05K 9/0049 (2013.01) 7 Claims
OG exemplary drawing
 
1. An electronic component comprising a package base and a metallic cap which is attached to the package base to form an enclosure, wherein the electronic component comprises at least one electronic chip which is mounted on a chip-mounting surface in the package base within the enclosure, whereby the chip-mounting surface defines a first plane,
wherein the metallic cap is a self-supporting cap, and the metallic cap separates the enclosure into at least a first cavity and a second cavity, and the electronic chip is in the first cavity, and the metallic cap separates the enclosure into the first and second cavities with its shape which forms:
at least one first sidewall and a first cavity ceiling joined to the at least one first sidewall,
at least one second sidewall and a second cavity ceiling joined to the at least one second sidewall, and
at least one separator which extends between the first cavity ceiling and the second cavity ceiling, wherein the separator extends from the first cavity ceiling toward the first plane and constitutes an internal shield within the electrical component, wherein a separator gap is formed between a bottom of the separator and the first plane, which connects the first cavity and the second cavity,
wherein the metallic cap is attached to the package base around a perimeter of the package base so that the enclosure is delimited by the package base and the metallic cap on all sides, and the electronic chip is a microelectromechanical (MEMS) chip.