US 12,075,603 B2
Shielded electronic component
Teppo Syrjänen, Helsinki (FI)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed on Mar. 14, 2022, as Appl. No. 17/693,847.
Claims priority of application No. 20215296 (FI), filed on Mar. 18, 2021.
Prior Publication US 2022/0304200 A1, Sep. 22, 2022
Int. Cl. H05K 9/00 (2006.01)
CPC H05K 9/0007 (2013.01) 8 Claims
OG exemplary drawing
 
1. An electronic component comprising a package base and a cap which is attached to the package base to form an enclosure, wherein the enclosure extends in a first direction and in a second direction which is orthogonal to the first, and the electronic component comprises at least one electronic chip which is mounted within said enclosure, and the electronic chip has a chip length in the first direction and a chip width in the second direction, and
wherein the electronic component comprises a metallic sheet which is fixed to the package base, and the metallic sheet comprises a first sheet side section on a first side of the enclosure and a central sheet section which underlies the electronic chip, and the metallic sheet extends in the first direction from the first sheet side section to the central sheet section,
and the cap comprises a metallic cap section which comprises a first cap side section on the first side of the enclosure and a central cap section which overlies the electronic chip, and the metallic cap section extends in the first direction from the first cap side section to the central cap section,
and the first sheet side section is in contact with the first cap side section so that the first sheet side section and first cap side section together form a first side-shield on the first side of the enclosure, and the first side-shield is completely embedded in a side of the package base so that the first side-shield is covered by and inside the package base.