US 12,075,600 B1
Fanless computer case
Anthony Lane Snyder, Bellingham, WA (US)
Filed by Anthony Lane Snyder, Bellingham, WA (US)
Filed on Jul. 8, 2022, as Appl. No. 17/861,139.
Claims priority of provisional application 63/219,721, filed on Jul. 8, 2021.
Int. Cl. H05K 7/20 (2006.01); G06F 1/20 (2006.01)
CPC H05K 7/20418 (2013.01) [G06F 1/20 (2013.01); H05K 7/20436 (2013.01); H05K 7/20445 (2013.01); H05K 7/20509 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A fanless computer case assembly is configured to distribute heat from a computer through a thermal accessory; the fanless computer case assembly comprising:
a fanless computer case comprises a bottom cover joined to a front panel and a rear panel; a top cover is joined to the front panel and the rear panel
a mother board further comprising a central processing unit, is arranged between the front panel and the rear panel;
an upper CPU mounting plate and a lower CPU mounting plate, joined to the central processing unit;
a base plate, attached to the upper CPU mounting plate and the top cover with a spacer creating an air gap between the base plate and the top cover;
a first heat transfer plate, attached to the lower CPU mounting plate and the bottom cover;
wherein heat from the central processing unit transfers through the lower CPU mounting plate, is spread across the first heat transfer plate through the bottom cover, and through the thermal accessory.