US 12,075,587 B2
Heat transfer interfaces for circuit card assembly (CCA) modules
Alexander Trotman, South Windsor, CT (US); Josh Kamp, Glastonbury, CT (US); Judy Schwartz, Longmeadow, MA (US); Robert DeFelice, South Windsor, CT (US); Michael Doe, Jr., Southwick, MA (US); and Anthony Matthew DeLugan, Westfield, MA (US)
Assigned to Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed by Hamilton Sundstrand Corporation, Charlotte, NC (US)
Filed on Feb. 17, 2022, as Appl. No. 17/673,992.
Prior Publication US 2023/0262917 A1, Aug. 17, 2023
Int. Cl. H05K 7/14 (2006.01); H05K 7/20 (2006.01)
CPC H05K 7/1404 (2013.01) [H05K 7/2039 (2013.01); H05K 7/20545 (2013.01)] 13 Claims
OG exemplary drawing
 
1. An electronic module assembly comprising:
a circuit card assembly (CCA) including heat generating electronic components;
a connector electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA; and
a heatsink mounted to the CCA and connected in thermal communication with the electronic components, wherein a wedge feature is defined along a lateral edge of the heatsink relative to the connector, wherein the wedge feature wedges down in a direction from a top edge of the CCA toward the connector, wherein the wedge feature is defined between two wedge surfaces, wherein each wedge surface is oblique relative to an insertion axis defined by the connector.