CPC H05K 7/1404 (2013.01) [H05K 7/2039 (2013.01); H05K 7/20545 (2013.01)] | 13 Claims |
1. An electronic module assembly comprising:
a circuit card assembly (CCA) including heat generating electronic components;
a connector electrically connected to the heat generating electronic components, wherein the connector is positioned at a connection end of the CCA; and
a heatsink mounted to the CCA and connected in thermal communication with the electronic components, wherein a wedge feature is defined along a lateral edge of the heatsink relative to the connector, wherein the wedge feature wedges down in a direction from a top edge of the CCA toward the connector, wherein the wedge feature is defined between two wedge surfaces, wherein each wedge surface is oblique relative to an insertion axis defined by the connector.
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