US 12,075,583 B2
Electronic device housing, electronic device, and compound body
Lan Ma, Shenzhen (CN); Haiyan Jin, Shenzhen (CN); Ling Pan, Shenzhen (CN); Na Yu, Shenzhen (CN); and Liang Chen, Shenzhen (CN)
Assigned to BYD COMPANY LIMITED, Shenzhen (CN)
Appl. No. 17/281,189
Filed by BYD COMPANY LIMITED, Guangdong (CN)
PCT Filed May 16, 2019, PCT No. PCT/CN2019/087230
§ 371(c)(1), (2) Date Mar. 29, 2021,
PCT Pub. No. WO2020/062890, PCT Pub. Date Apr. 2, 2020.
Claims priority of application No. 201811161748.4 (CN), filed on Sep. 30, 2018.
Prior Publication US 2021/0400831 A1, Dec. 23, 2021
Int. Cl. H05K 5/06 (2006.01); C03C 8/08 (2006.01); C03C 8/24 (2006.01); C04B 37/04 (2006.01); H04M 1/02 (2006.01); H05K 5/02 (2006.01)
CPC H05K 5/06 (2013.01) [C03C 8/08 (2013.01); C03C 8/24 (2013.01); C04B 37/045 (2013.01); H04M 1/026 (2013.01); H05K 5/0217 (2013.01); C04B 2237/10 (2013.01); C04B 2237/343 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An electronic device housing, comprising:
a frame;
a sealing layer, disposed on at least a part of an outer surface of the frame, and comprising a plurality of sub-sealing layers laminated in sequence; and
a back case, attached to the frame by the sealing layer,
wherein thermal expansion coefficients of the sub-sealing layers increase or decrease along a direction from the frame to the back case, each of the sub-sealing layers is formed with a material comprising a glass powder and a binder, a weight ratio of the glass powder to the binder is 88-92:8-12, and glass powders in two adjacent sub-sealing layers of the sub-sealing layers have different compositions.