US 12,075,569 B2
Circuit board producing apparatus
Yasuo Matsumura, Kanagawa (JP); Sumiaki Yamasaki, Kanagawa (JP); Tsuyoshi Murakami, Kanagawa (JP); Kana Yoshida, Kanagawa (JP); and Shuji Sato, Kanagawa (JP)
Assigned to FUJIFILM Business Innovation Corp., Tokyo (JP)
Filed by FUJIFILM Business Innovation Corp., Tokyo (JP)
Filed on Jan. 25, 2022, as Appl. No. 17/583,215.
Application 17/583,215 is a division of application No. 16/253,226, filed on Jan. 22, 2019, granted, now 11,272,622.
Claims priority of application No. 2018-171873 (JP), filed on Sep. 13, 2018.
Prior Publication US 2022/0151077 A1, May 12, 2022
Int. Cl. H05K 3/12 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 3/02 (2006.01)
CPC H05K 3/1266 (2013.01) [H05K 1/0298 (2013.01); H05K 1/188 (2013.01); H05K 3/025 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A circuit board producing apparatus comprising:
a wire forming device, including:
a retention roller that retains conductive foils;
a conductive foil transfer roller that is arranged obliquely below and directly in contact with the retention roller, said conductive foil transfer roller operatively associated with the retention roller to transfer the conductive foils onto a toner image formed of a thermoplastic toner and formed on a substrate to form a conductive foil layer on the toner image, and
an opposing roller that is arranged below and opposite to the conductive foil transfer roller, said opposing roller including a heating source configured to apply heat to the toner image of the thermoplastic toner and the conductive foil layer to form a wire constituted by the conductive foils, wherein the conductive foil layer has a thickness in a range of 0.1 μm to 2 μm.