US 12,075,563 B2
Multilayer printed circuit board and electronic device
Minoru Wakabayashi, Tokyo (JP); Yosuke Maki, Tokyo (JP); and Yuito Tsuji, Tokyo (JP)
Assigned to Sony Interactive Entertainment Inc., Tokyo (JP)
Appl. No. 17/783,078
Filed by Sony Interactive Entertainment Inc., Tokyo (JP)
PCT Filed Sep. 24, 2020, PCT No. PCT/JP2020/036097
§ 371(c)(1), (2) Date Jun. 7, 2022,
PCT Pub. No. WO2021/117313, PCT Pub. Date Jun. 17, 2021.
Claims priority of application No. 2019-224857 (JP), filed on Dec. 12, 2019.
Prior Publication US 2023/0022992 A1, Jan. 26, 2023
Int. Cl. H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/0298 (2013.01) [H05K 1/05 (2013.01); H05K 1/09 (2013.01); H05K 3/46 (2013.01); H05K 2201/10098 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A multilayer printed circuit board comprising:
a plurality of conductive layers formed by a conductive material, wherein
a blank region with the conductive material removed is formed in at least part of at least one intermediate conductive layer that is formed inside the multilayer printed circuit board, among the plurality of conductive layers,
a plurality of island regions are formed by the conductive material included in the intermediate conductive layer in the blank region,
each of the plurality of island regions is not electrically connected to other regions included in the intermediate conductive layer and is disposed so as to be dispersed from one another, and
wherein part of a concentration region among the blank region is formed with the plurality of island regions more densely than regions other than the concentration region.