CPC H05K 1/0271 (2013.01) [H01L 23/5389 (2013.01); H05K 1/0203 (2013.01); H05K 1/0216 (2013.01); H05K 1/028 (2013.01); H05K 1/185 (2013.01); H05K 3/007 (2013.01); H05K 3/30 (2013.01); H05K 3/301 (2013.01); H05K 3/4611 (2013.01); H05K 3/4652 (2013.01); H05K 2201/068 (2013.01); H05K 2203/1469 (2013.01)] | 20 Claims |
1. A method of fixing a component, the method comprising:
providing a base structure having a main surface, the base structure defining a cavity that is at least partially covered by a component fixation structure;
providing a component, the component intrinsically comprising warpage such that the component shows bending prior to mounting; thereafter,
mounting the component on a surface of a carrier to thereby remove the warpage of the component at least partially as a result of the mounting; and
fixing the component by interconnecting the base structure with the carrier so that the component extends into the component fixation structure in the cavity.
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