CPC H05K 1/021 (2013.01) [G02B 6/4273 (2013.01); H05K 1/0216 (2013.01); H05K 1/0274 (2013.01); H05K 2201/10121 (2013.01)] | 34 Claims |
1. An optical module, comprising:
a housing;
a heat sink apparatus arranged in and thermally connected to the housing; and
a printed circuit board adhered to the heat sink apparatus,
wherein
the optical module further comprises an optoelectronic chip arranged on the heat sink apparatus,
the printed circuit board has a first surface, a second surface opposite to the first surface, and an opening that extends from the first surface to the second surface,
the heat sink apparatus is connected to the second surface,
the opening is located near a center of the printed circuit board,
the optoelectronic chip is arranged in the opening,
the printed circuit board has a first end arranged with an external electrical interface, and a second end opposite to the first end, and
the opening is spaced apart from the second end.
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