US 12,075,558 B2
Printed circuit board
Zhaozheng Hou, Dongguan (CN); Xiaojing Liao, Shanghai (CN); Chao Shen, Shanghai (CN); and Dongxing Wang, Shanghai (CN)
Assigned to Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed by Huawei Digital Power Technologies Co., Ltd., Shenzhen (CN)
Filed on Dec. 22, 2021, as Appl. No. 17/559,763.
Claims priority of application No. 202011535522.3 (CN), filed on Dec. 23, 2020.
Prior Publication US 2022/0201837 A1, Jun. 23, 2022
Int. Cl. H05K 1/00 (2006.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 7/20 (2006.01)
CPC H05K 1/0204 (2013.01) [H05K 1/0203 (2013.01); H05K 1/0272 (2013.01); H05K 1/182 (2013.01); H05K 1/185 (2013.01); H05K 7/20218 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A printed circuit board, comprising:
a substrate, wherein the substrate is a board body of the printed circuit board;
a heating component embedded in the substrate; and
a cooling liquid channel is disposed in the substrate, wherein cooling liquid flows in the cooling liquid channel, and the cooling liquid channel passes two or more surfaces of the heating component, so that the cooling liquid exchanges heat with the heating component;
wherein copper foil is disposed on the two or more surfaces of the heating component, one surface of the copper foil is in contact with the two or more surfaces of the heating component, and the other surface of the copper foil is in contact with the cooling liquid channel, so that the cooling liquid exchanges heat with the two or more surfaces of the heating component by using the copper foil.