US 12,075,141 B2
Heatsinks and thermal architecture of an image capture device
Nicholas Vitale, Foster City, CA (US); and Raul Vargas Gonzalez, Redwood City, CA (US)
Assigned to GoPro, Inc., San Mateo, CA (US)
Filed by GoPro, Inc., San Mateo, CA (US)
Filed on Sep. 2, 2022, as Appl. No. 17/901,964.
Application 17/901,964 is a continuation in part of application No. 17/893,673, filed on Aug. 23, 2022.
Prior Publication US 2024/0073499 A1, Feb. 29, 2024
Int. Cl. H04N 23/52 (2023.01); H04N 23/51 (2023.01); H05K 7/20 (2006.01)
CPC H04N 23/52 (2023.01) [H04N 23/51 (2023.01); H05K 7/2039 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An image capture device comprising: heat generating devices that generate a thermal load; one or more batteries; a chassis that is located within the image capture device, the chassis being in thermal communication with a second of the heat generating devices; a sensor heat spreader in thermal communication with one or more of the heat generating devices and extending from the one or more of the heat generating devices in contact with an entire side surface of the one or more batteries so that all or a portion of the thermal load is transferred to the one or more batteries via the entire side surface via the entire side surface; wherein a rear heatsink forms an entire rear wall of the image capture device.