US 12,074,628 B2
Packaged electrical device
Andrew Martin Kay, Lake Forest, CA (US)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by SKYWORKS SOLUTIONS, INC., Irvine, CA (US)
Filed on Mar. 28, 2023, as Appl. No. 18/127,598.
Application 18/127,598 is a continuation of application No. 16/139,163, filed on Sep. 24, 2018, granted, now 11,616,526.
Application 16/139,163 is a continuation of application No. 14/883,472, filed on Oct. 14, 2015, granted, now 10,084,503, issued on Sep. 25, 2018.
Claims priority of provisional application 62/064,435, filed on Oct. 15, 2014.
Prior Publication US 2023/0387957 A1, Nov. 30, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 1/40 (2015.01); H01C 1/148 (2006.01); H01G 2/06 (2006.01); H01G 4/012 (2006.01); H01G 4/232 (2006.01); H01G 4/30 (2006.01); H01L 23/66 (2006.01); H01F 17/00 (2006.01)
CPC H04B 1/40 (2013.01) [H01C 1/148 (2013.01); H01G 2/065 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/30 (2013.01); H01F 17/0013 (2013.01); H01L 23/66 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/141 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19043 (2013.01); H01L 2924/19105 (2013.01)] 3 Claims
OG exemplary drawing
 
1. A surface-mount device comprising:
an electrical element including a capacitance element or an inductance element;
a body configured to support the electrical element and having a rectangular cuboid shape with a length, a width, and a height that is greater than the width, the body including a base plane configured to allow mounting of the surface-mount device; and
first and second terminals implemented on the base plane and connected to the electrical element to be capable of providing electrical connections between the electrical element and a packaging substrate or a circuit board when the surface-mount device is mounted thereon.