US 12,074,620 B2
High-frequency module and communication device
Takayuki Shinozaki, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Apr. 18, 2023, as Appl. No. 18/301,990.
Application 18/301,990 is a continuation of application No. 17/685,390, filed on Mar. 3, 2022, granted, now 11,658,691.
Application 17/685,390 is a continuation of application No. PCT/JP2020/023117, filed on Jun. 11, 2020.
Claims priority of application No. 2019-163392 (JP), filed on Sep. 6, 2019.
Prior Publication US 2023/0253993 A1, Aug. 10, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. H04B 1/04 (2006.01); H04B 1/03 (2006.01); H04B 1/08 (2006.01)
CPC H04B 1/04 (2013.01) [H04B 1/03 (2013.01); H04B 1/08 (2013.01); H04B 2001/0408 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A high-frequency module comprising:
an antenna terminal;
an input terminal;
a second switch connected between the antenna terminal and the input terminal;
a power amplifier connected between the second switch and the input terminal; and
a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate, wherein
the power amplifier includes
a driver stage amplifier and an output stage amplifier,
the driver stage amplifier and the second switch are arranged on the second main surface of the mounting substrate, and
the output stage amplifier is arranged on the first main surface of the mounting substrate, and
the driver state amplifier and the second switch are including in one semiconductor chip.