US 12,074,619 B2
Radio frequency module and communication device
Naohide Tomita, Nagaokakyo (JP)
Assigned to MURATA MANUFACTURING CO., LTD., Nagaokakyo (JP)
Filed by Murata Manufacturing Co., Ltd., Nagaokakyo (JP)
Filed on Dec. 1, 2021, as Appl. No. 17/539,215.
Application 17/539,215 is a continuation of application No. PCT/JP2020/022654, filed on Jun. 9, 2020.
Claims priority of application No. 2019-124838 (JP), filed on Jul. 3, 2019.
Prior Publication US 2022/0094376 A1, Mar. 24, 2022
Int. Cl. H04B 1/00 (2006.01); H04B 1/04 (2006.01); H04B 1/16 (2006.01)
CPC H04B 1/0067 (2013.01) [H04B 1/006 (2013.01); H04B 1/04 (2013.01); H04B 1/1607 (2013.01); H04B 2001/0408 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A radio frequency module including
a mounting substrate having a first main surface and a second main surface on opposite sides of the mounting substrate;
a power amplifier mounted on the first main surface of the mounting substrate;
a switch mounted on the second main surface of the mounting substrate and provided in a signal path for a transmission signal;
a low noise amplifier mounted on the second main surface of the mounting substrate and provided in a signal path for a reception signal; and
a ground terminal positioned between the switch and the low noise amplifier as viewed in a plan view from a thickness direction of the mounting substrate.