US 12,074,581 B2
Methods and assemblies related to fabrication of acoustic wave devices
Michio Kadota, Sendai (JP); Shuji Tanaka, Sendai (JP); and Yoshimi Ishii, Sendai (JP)
Assigned to Skyworks Solutions, Inc., Irvine, CA (US)
Filed by TOHOKU UNIVERSITY, Sendai (JP)
Filed on Oct. 15, 2019, as Appl. No. 16/653,965.
Claims priority of provisional application 62/746,512, filed on Oct. 16, 2018.
Prior Publication US 2020/0119711 A1, Apr. 16, 2020
Int. Cl. H03H 9/64 (2006.01); H03H 3/08 (2006.01); H03H 9/02 (2006.01); H03H 9/145 (2006.01); H03H 9/25 (2006.01)
CPC H03H 9/02551 (2013.01) [H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A method for fabricating an acoustic wave device, the method comprising:
forming or providing a piezoelectric layer having a surface on a first side and a surface on a second side opposite from the first side;
attaching the first side of the piezoelectric layer to a handling substrate;
performing a thinning operation on the second side of the piezoelectric layer to form a reduced-thickness piezoelectric layer having a new surface on the second side;
bonding the second side of the reduced-thickness piezoelectric layer to a permanent substrate; and
removing the handling substrate from the second side of the reduced-thickness piezoelectric layer.