CPC H03H 9/02551 (2013.01) [H03H 3/08 (2013.01); H03H 9/02574 (2013.01); H03H 9/145 (2013.01); H03H 9/25 (2013.01); H03H 9/64 (2013.01)] | 13 Claims |
1. A method for fabricating an acoustic wave device, the method comprising:
forming or providing a piezoelectric layer having a surface on a first side and a surface on a second side opposite from the first side;
attaching the first side of the piezoelectric layer to a handling substrate;
performing a thinning operation on the second side of the piezoelectric layer to form a reduced-thickness piezoelectric layer having a new surface on the second side;
bonding the second side of the reduced-thickness piezoelectric layer to a permanent substrate; and
removing the handling substrate from the second side of the reduced-thickness piezoelectric layer.
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