US 12,074,511 B2
Direct current power supply device and air conditioner
Hiroki Suzuki, Tokyo (JP); Keiichiro Shizu, Tokyo (JP); and Tomohiro Kutsuki, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Appl. No. 17/627,367
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
PCT Filed Nov. 6, 2019, PCT No. PCT/JP2019/043548
§ 371(c)(1), (2) Date Jan. 14, 2022,
PCT Pub. No. WO2021/090416, PCT Pub. Date May 14, 2021.
Prior Publication US 2022/0271647 A1, Aug. 25, 2022
Int. Cl. H02M 3/158 (2006.01); F25B 49/02 (2006.01); H02M 1/32 (2007.01); H02M 7/06 (2006.01); H02P 27/06 (2006.01); H05K 7/20 (2006.01)
CPC H02M 1/32 (2013.01) [F25B 49/022 (2013.01); H02M 7/06 (2013.01); H02P 27/06 (2013.01); H05K 7/209 (2013.01); F25B 2600/021 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A direct current power supply device that converts alternating current power supplied from an alternating current power supply into direct current power and supplies the direct current power to a load, the direct current power supply device comprising:
a rectifier circuit to rectify the alternating current power supplied from the alternating current power supply and convert the alternating current power into the direct current power;
a first output terminal and a second output terminal that are terminals for outputting the direct current power from the direct current power supply device to the load;
a charge storage device connected to the first output terminal and the second output terminal and including a function of storing a charge;
a charger to charge the charge storage device on the basis of the direct current power obtained by the rectifier circuit; and
a heat sink, wherein
the charge storage device includes a positive-side capacitor and a negative-side capacitor connected in series,
the charger includes a positive-side switching element, a negative-side switching element, a positive-side backflow prevention diode, and a negative-side backflow prevention diode for charging one or both of the positive-side capacitor and the negative-side capacitor,
the positive-side switching element, the negative-side switching element, the positive-side backflow prevention diode, and the negative-side backflow prevention diode are discrete semiconductor elements,
the heat sink includes a function of dissipating heat of the positive-side switching element, the negative-side switching element, the positive-side backflow prevention diode, and the negative-side backflow prevention diode,
the positive-side switching element, the negative-side switching element, the positive-side backflow prevention diode, and the negative-side backflow prevention diode are disposed on one or a plurality of planes of the heat sink,
the negative-side backflow prevention diode is a full mold package element, and
the positive-side switching element, the negative-side switching element, and the positive-side backflow prevention diode are elements that are not full mold packages.