US 12,074,360 B2
RFIC assembled antenna
Byoung Nam Kim, Suwon-si (KR); Hong Il Yoo, Gwangmyeong-si (KR); Chul-Keun Park, Seongnam-si (KR); and Chan-Woo Park, Seoul (KR)
Assigned to SENSORVIEW CO., LTD., Seongnam-si (KR)
Filed by SENSORVIEW CO., LTD., Seongnam-si (KR)
Filed on Oct. 17, 2022, as Appl. No. 18/047,089.
Claims priority of application No. 10-2021-0141695 (KR), filed on Oct. 22, 2021; and application No. 10-2022-0012395 (KR), filed on Jan. 27, 2022.
Prior Publication US 2023/0129616 A1, Apr. 27, 2023
Int. Cl. H01Q 1/22 (2006.01); G06K 19/077 (2006.01); H01Q 1/38 (2006.01)
CPC H01Q 1/2283 (2013.01) [G06K 19/0775 (2013.01); H01Q 1/38 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An RFIC (Radio-Frequency Integrated Circuit) assembled antenna, comprising:
a first layer substrate including a first metal pattern, a first slot formed in the first metal pattern, and a second slot formed to be connected to the first slot, and in which an RFIC chip is coupled to a region of the second slot; and
a second layer substrate coupled to a lower portion of the first layer substrate and including a second metal pattern, a third slot formed in the second metal pattern, and a dipole radiator formed inside the third slot,
wherein a feeding pattern connected to the RFIC chip to provide a feed signal to the dipole radiator is formed inside the first slot.