US 12,074,244 B2
Optical sensor package with magnetic component for device attachment
Saijin Liu, San Jose, CA (US); Tongbi T. Jiang, Santa Clara, CA (US); and Saahil Mehra, Saratoga, CA (US)
Assigned to Apple Inc., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on Sep. 13, 2021, as Appl. No. 17/473,745.
Claims priority of provisional application 63/078,220, filed on Sep. 14, 2020.
Prior Publication US 2022/0085231 A1, Mar. 17, 2022
Int. Cl. H01L 31/167 (2006.01); A61B 5/00 (2006.01); G04C 10/00 (2006.01); G04G 21/02 (2010.01); G06F 1/16 (2006.01); H02J 50/10 (2016.01)
CPC H01L 31/167 (2013.01) [A61B 5/0059 (2013.01); A61B 5/681 (2013.01); G04C 10/00 (2013.01); G04G 21/025 (2013.01); G06F 1/163 (2013.01); H02J 50/10 (2016.02)] 20 Claims
OG exemplary drawing
 
1. An integrated sensor package for an electronic device, comprising:
a matrix material defining a body structure of the integrated sensor package;
a light emitting diode at least partially encapsulated in the matrix material;
a photodiode at least partially encapsulated in the matrix material and configured to detect light emitted by the light emitting diode and reflected by an object external to the integrated sensor package;
a via structure at least partially encapsulated in the matrix material;
a permanent magnet at least partially encapsulated in the matrix material;
a first conductive member on a first side of the integrated sensor package and conductively coupling the light emitting diode to a first end of the via structure; and
a second conductive member on a second side of the integrated sensor package opposite the first side and conductively coupled to a second end of the via structure.