US 12,074,213 B2
Methods and devices for fabricating and assembling printable semiconductor elements
Ralph G. Nuzzo, Champaign, IL (US); John A. Rogers, Wilmette, IL (US); Etienne Menard, Voglans (FR); Keon Jae Lee, Daejeon (KR); Dahl-Young Khang, Seoul (KR); Yugang Sun, Gladwyne, PA (US); Matthew Meitl, Durham, NC (US); and Zhengtao Zhu, Rapid City, SD (US)
Assigned to The Board of Trustees of the University of Illinois, Urbana, IL (US)
Filed by The Board of Trustees of the University of Illinois, Urbana, IL (US)
Filed on Jun. 24, 2021, as Appl. No. 17/357,697.
Application 12/564,566 is a division of application No. 11/145,574, filed on Jun. 2, 2005, granted, now 7,622,367, issued on Nov. 24, 2009.
Application 17/357,697 is a continuation of application No. 16/448,988, filed on Jun. 21, 2019, granted, now 11,088,268.
Application 16/448,988 is a continuation of application No. 15/640,206, filed on Jun. 30, 2017, granted, now 10,374,072, issued on Aug. 6, 2019.
Application 15/640,206 is a continuation of application No. 15/084,091, filed on Mar. 29, 2016, granted, now 9,761,444, issued on Sep. 12, 2017.
Application 15/640,206 is a continuation of application No. 15/084,211, filed on Mar. 29, 2016, granted, now 9,768,086, issued on Sep. 19, 2017.
Application 15/084,091 is a continuation of application No. 14/155,010, filed on Jan. 14, 2014, granted, now 9,450,043, issued on Sep. 20, 2016.
Application 15/084,091 is a continuation of application No. 14/155,010, filed on Jan. 14, 2014, granted, now 9,450,043, issued on Sep. 20, 2016.
Application 14/155,010 is a continuation of application No. 13/801,868, filed on Mar. 13, 2013, granted, now 8,664,699, issued on Mar. 4, 2014.
Application 13/801,868 is a continuation of application No. 13/113,504, filed on May 23, 2011, granted, now 8,440,546, issued on May 14, 2013.
Application 13/113,504 is a continuation of application No. 12/564,566, filed on Sep. 22, 2009, granted, now 7,982,296, issued on Jul. 19, 2011.
Claims priority of provisional application 60/677,617, filed on May 4, 2005.
Claims priority of provisional application 60/663,391, filed on Mar. 18, 2005.
Claims priority of provisional application 60/650,305, filed on Feb. 4, 2005.
Claims priority of provisional application 60/601,061, filed on Aug. 11, 2004.
Claims priority of provisional application 60/577,077, filed on Jun. 4, 2004.
Prior Publication US 2021/0343862 A1, Nov. 4, 2021
Int. Cl. H01L 29/76 (2006.01); B82Y 10/00 (2011.01); H01L 21/02 (2006.01); H01L 21/308 (2006.01); H01L 21/322 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/02 (2006.01); H01L 25/075 (2006.01); H01L 27/12 (2006.01); H01L 29/04 (2006.01); H01L 29/06 (2006.01); H01L 29/12 (2006.01); H01L 29/786 (2006.01); H01L 31/0392 (2006.01); H01L 31/18 (2006.01); H01L 33/00 (2010.01); H01L 33/32 (2010.01)
CPC H01L 29/76 (2013.01) [B82Y 10/00 (2013.01); H01L 21/02521 (2013.01); H01L 21/02603 (2013.01); H01L 21/02628 (2013.01); H01L 21/308 (2013.01); H01L 21/322 (2013.01); H01L 21/6835 (2013.01); H01L 23/02 (2013.01); H01L 24/03 (2013.01); H01L 24/80 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/0753 (2013.01); H01L 27/1285 (2013.01); H01L 27/1292 (2013.01); H01L 29/04 (2013.01); H01L 29/06 (2013.01); H01L 29/0665 (2013.01); H01L 29/0673 (2013.01); H01L 29/0676 (2013.01); H01L 29/068 (2013.01); H01L 29/12 (2013.01); H01L 29/78603 (2013.01); H01L 29/78681 (2013.01); H01L 29/78696 (2013.01); H01L 31/0392 (2013.01); H01L 31/03926 (2013.01); H01L 31/1804 (2013.01); H01L 31/1864 (2013.01); H01L 31/1896 (2013.01); H01L 33/007 (2013.01); H01L 33/0093 (2020.05); H01L 33/32 (2013.01); B81C 2201/0185 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/94 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/03 (2013.01); H01L 2224/0332 (2013.01); H01L 2224/0345 (2013.01); H01L 2224/03614 (2013.01); H01L 2224/0362 (2013.01); H01L 2224/05073 (2013.01); H01L 2224/05082 (2013.01); H01L 2224/05124 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05552 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/05555 (2013.01); H01L 2224/05644 (2013.01); H01L 2224/05666 (2013.01); H01L 2224/08225 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/80 (2013.01); H01L 2224/80006 (2013.01); H01L 2224/80121 (2013.01); H01L 2224/80862 (2013.01); H01L 2224/80895 (2013.01); H01L 2224/83 (2013.01); H01L 2224/83005 (2013.01); H01L 2224/83121 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83193 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83862 (2013.01); H01L 2224/9202 (2013.01); H01L 2224/94 (2013.01); H01L 2224/95 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00012 (2013.01); H01L 2924/01032 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/12032 (2013.01); H01L 2924/12036 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13063 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15159 (2013.01); H01L 2924/15162 (2013.01); H01L 2924/15788 (2013.01); H01L 2924/1579 (2013.01); Y02E 10/547 (2013.01); Y02P 70/50 (2015.11); Y10S 977/707 (2013.01); Y10S 977/724 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A printed semiconductor device comprising:
a substrate having a receiving surface;
a semiconductor element comprising a unitary inorganic semiconductor structure disposed on the receiving surface;
wherein the semiconductor element is connected to at least a portion of a fractured alignment maintaining element.