US 12,074,192 B2
Chip-scale optical interconnect using microLEDs
Bardia Pezeshki, Sunnyvale, CA (US); and Robert Kalman, Sunnyvale, CA (US)
Assigned to AvicenaTech, Corp., Sunnyvale, CA (US)
Filed by AvicenaTech Corp., Mountain View, CA (US)
Filed on Nov. 18, 2022, as Appl. No. 17/990,425.
Application 17/990,425 is a division of application No. 16/913,905, filed on Jun. 26, 2020, granted, now 11,515,356.
Claims priority of provisional application 62/900,383, filed on Sep. 13, 2019.
Claims priority of provisional application 62/867,448, filed on Jun. 27, 2019.
Prior Publication US 2023/0091939 A1, Mar. 23, 2023
Int. Cl. G02B 6/43 (2006.01); G02B 6/42 (2006.01); H01L 27/15 (2006.01)
CPC H01L 27/156 (2013.01) [G02B 6/4214 (2013.01); G02B 6/4257 (2013.01); G02B 6/43 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A multi-chip module with optical communications capability, comprising:
a semiconductor package;
a substrate within the semiconductor package;
a first semiconductor chip including logic circuitry within the semiconductor package, the first semiconductor chip electrically coupled to the substrate;
a plurality of first microLEDs bonded to the first semiconductor chip within the semiconductor package;
circuitry in the first semiconductor chip for driving the plurality of first microLEDs based on signals of the logic circuitry of the first semiconductor chip;
a plurality of waveguides; and
a plurality of first photodetectors within the semiconductor package, the plurality of first photodetectors electrically coupled to the logic circuitry of the first semiconductor chip;
wherein the plurality of first microLEDs and the plurality of first photodetectors are optically coupled to the plurality of waveguides; and
further comprising lenses to couple light from the plurality of first microLEDs into the plurality of waveguides.