US 12,074,182 B2
Semiconductor device, electronic apparatus, and method for manufacturing semiconductor device
Masaki Hatano, Kanagawa (JP)
Assigned to SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
Appl. No. 17/267,632
Filed by SONY SEMICONDUCTOR SOLUTIONS CORPORATION, Kanagawa (JP)
PCT Filed Jun. 24, 2019, PCT No. PCT/JP2019/025003
§ 371(c)(1), (2) Date Feb. 10, 2021,
PCT Pub. No. WO2020/039733, PCT Pub. Date Feb. 27, 2020.
Claims priority of application No. 2018-154708 (JP), filed on Aug. 21, 2018.
Prior Publication US 2021/0313367 A1, Oct. 7, 2021
Int. Cl. H01L 27/146 (2006.01); H01L 31/024 (2014.01)
CPC H01L 27/14618 (2013.01) [H01L 27/14683 (2013.01); H01L 31/024 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A semiconductor device, comprising:
a semiconductor element;
a substrate part having a recess, wherein
the recess is open to face a front surface side that is a light-receiving side, and
the substrate part positions the semiconductor element on the front surface side; and
a plate shaped member in the recess in a state where the plate shaped member is fixed to the substrate part, wherein
the semiconductor element is fixed to a first plate surface side of the plate shaped member, and
the plate shaped member is provided via a gap on at least a second plate surface side, opposite to the first plate surface side, of the plate shaped member with respect to a surface of the substrate part that provides the recess.