US 12,074,154 B2
Package structure
Tsung-Shu Lin, New Taipei (TW); Tsung-Yu Chen, Hsinchu (TW); and Wensen Hung, Hsinchu County (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jan. 25, 2022, as Appl. No. 17/584,308.
Application 17/584,308 is a continuation of application No. 16/877,504, filed on May 19, 2020, granted, now 11,282,825.
Prior Publication US 2022/0149030 A1, May 12, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 25/18 (2023.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/40 (2006.01); H01L 23/46 (2006.01); H01L 23/498 (2006.01)
CPC H01L 25/18 (2013.01) [H01L 23/3135 (2013.01); H01L 23/4006 (2013.01); H01L 23/46 (2013.01); H01L 23/49816 (2013.01); H01L 23/49833 (2013.01); H01L 24/16 (2013.01); H01L 2023/405 (2013.01); H01L 2023/4087 (2013.01); H01L 2224/16227 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A structure, comprising:
a wiring substrate;
a device comprising a semiconductor die laterally encapsulated by a first insulating encapsulation, the semiconductor die being disposed on and electrical connected to the wiring substrate;
a second insulating encapsulation disposed on the wiring substrate, wherein the device is laterally encapsulated by the second insulating encapsulation;
a lid disposed on the device and the second insulating encapsulation;
a reinforcement structure embedded in the second insulating encapsulation; and
fastening elements penetrating through the lid, wherein the lid is fastened to the reinforcement structure through the fastening elements.