CPC H01L 25/16 (2013.01) [H01L 23/142 (2013.01); H01L 23/3107 (2013.01); H01L 23/3735 (2013.01); H01L 27/0883 (2013.01); H03K 17/6871 (2013.01); H03K 2217/0063 (2013.01); H03K 2217/0072 (2013.01)] | 23 Claims |
1. An electronic module, comprising:
a package and a conductive lead frame; the conductive lead frame comprising a first portion configured to be connected to a high voltage node, a second portion configured to be connected to an output node and a third portion configured to be connected to a ground node, wherein each of the first portion, second portion and third portion is electrically isolated from one another;
a high-side switch comprising a first enhancement-mode transistor and a III-N depletion-mode transistor in a cascode configuration, wherein the III-N depletion-mode transistor comprises a III-N material structure on an electrically conductive substrate; and
a low-side switch;
wherein a drain electrode of the III-N depletion-mode transistor is electrically connected to the first portion of the lead frame, a source electrode of the enhancement-mode transistor is electrically connected to the second portion of the lead frame, a gate electrode of the depletion-mode transistor is electrically connected to the electrically conductive substrate of the depletion-mode transistor, and the substrate of the depletion-mode transistor is electrically connected to the second portion of the lead frame.
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