US 12,074,143 B2
Integrated circuit package and method
Chen-Hua Yu, Hsinchu (TW); Chi-Hui Lai, Taichung (TW); Tin-Hao Kuo, Hsinchu (TW); Hao-Yi Tsai, Hsinchu (TW); and Chung-Shi Liu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu (TW)
Filed on Jul. 27, 2022, as Appl. No. 17/874,598.
Application 17/874,598 is a division of application No. 16/900,589, filed on Jun. 12, 2020, granted, now 11,417,633.
Claims priority of provisional application 62/941,328, filed on Nov. 27, 2019.
Prior Publication US 2022/0367420 A1, Nov. 17, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/367 (2006.01); H01L 23/40 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 21/56 (2013.01); H01L 23/3114 (2013.01); H01L 23/367 (2013.01); H01L 23/4006 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A method comprising:
forming a first package component, wherein forming the first package component comprises:
encapsulating a first integrated circuit die with an encapsulant; and
forming a redistribution structure on the encapsulant and an active side of the first integrated circuit die;
bonding a power module to the redistribution structure of the first package component, the power module comprising active devices;
forming a first thermal interface material (TIM) on a backside of the first integrated circuit die and on a surface of the encapsulant;
attaching a first thermal module coupled to the first TIM;
forming a second TIM on a backside of the power module;
attaching a second thermal module to the second TIM;
attaching a mechanical brace to the first thermal module and the second thermal module, the mechanical brace comprising compression parts and a body, the body of the mechanical brace extending from a top surface of the second thermal module to a bottom surface of the first thermal module, the mechanical brace physically contacting the first thermal module and the second thermal module; and
adjusting the compression parts of the mechanical brace to increase a pressure on the first TIM and the second TIM.