US 12,074,141 B2
Semiconductor package
Seung Hun Shin, Cheonan-si (KR); Un Byoung Kang, Hwaseong-si (KR); Yeong Kwon Ko, Hwaseong-si (KR); Jong Ho Lee, Hwaseong-si (KR); Teak Hoon Lee, Hwaseong-si (KR); and Jun Yeong Heo, Suwon-si (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Nov. 19, 2021, as Appl. No. 17/531,115.
Claims priority of application No. 10-2021-0031127 (KR), filed on Mar. 10, 2021.
Prior Publication US 2022/0293565 A1, Sep. 15, 2022
Int. Cl. H01L 23/498 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 25/065 (2023.01)
CPC H01L 25/0657 (2013.01) [H01L 23/3142 (2013.01); H01L 23/481 (2013.01); H01L 23/49838 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01)] 13 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a first semiconductor chip which includes a first chip substrate and a first through via penetrating the first chip substrate;
a second semiconductor chip disposed on the first semiconductor chip, the second semiconductor chip includes a second chip substrate and a second through via penetrating the second chip substrate;
a connecting terminal disposed between the first semiconductor chip and the second semiconductor chip to electrically connect the first through via and the second through via; and
an inter-chip molding material which includes a filling portion that fills between the first semiconductor chip and the second semiconductor chip and encloses the connecting terminal, an extension portion that extends in a first direction along at least a part of a side surface of the second semiconductor chip, and a protruding portion protruding from the extension portion in a second direction that is perpendicular to the first direction.