US 12,074,139 B2
Semiconductor device having dolmen structure and manufacturing method therefor, and support piece formation laminate film and manufacturing method therefor
Tatsuya Yahata, Tokyo (JP); Kohei Taniguchi, Tokyo (JP); Shintaro Hashimoto, Tokyo (JP); Yoshinobu Ozaki, Tokyo (JP); and Kei Itagaki, Tokyo (JP)
Appl. No. 17/439,402
Filed by Resonac Corporation, Tokyo (JP)
PCT Filed Apr. 24, 2020, PCT No. PCT/JP2020/017728
§ 371(c)(1), (2) Date Sep. 15, 2021,
PCT Pub. No. WO2020/218523, PCT Pub. Date Oct. 29, 2020.
Claims priority of application No. PCT/JP2019/017701 (WO), filed on Apr. 25, 2019.
Prior Publication US 2022/0149008 A1, May 12, 2022
Int. Cl. H01L 25/065 (2023.01); H01L 25/00 (2006.01)
CPC H01L 25/0657 (2013.01) [H01L 25/50 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06562 (2013.01); H01L 2225/06575 (2013.01); H01L 2225/06582 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A manufacturing method for a semiconductor device having a dolmen structure, the semiconductor device comprising: a substrate; a first chip disposed on the substrate; a plurality of support pieces disposed around the first chip on the substrate; and a second chip disposed to be supported by the plurality of support pieces and to cover the first chip, the method comprising processes of:
(A) preparing a laminate film comprising a base material film, a pressure-sensitive adhesive layer and a support piece formation film in order, wherein the support piece formation film has a multi-layer structure comprising a metal layer and a thermosetting resin layer that is in contact with the metal layer and with the pressure-sensitive adhesive layer;
(B) forming the plurality of support pieces on a surface of the pressure-sensitive adhesive layer by singulating the support piece formation film;
(C) picking up the plurality of support pieces from the pressure-sensitive adhesive layer;
(D) disposing the first chip on the substrate;
(E) disposing the plurality of support pieces onto the substrate around the first chip or around a region in which the first chip is to be disposed on the substrate;
(F) preparing an adhesive piece-attached chip comprising the second chip and a bonding adhesive piece provided on one surface of the second chip; and
(G) constructing the dolmen structure by disposing the adhesive piece-attached chip on surfaces of the plurality of support pieces.