CPC H01L 24/29 (2013.01) [H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/3157 (2013.01); H01L 23/544 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 2223/54426 (2013.01)] | 20 Claims |
1. A package structure, comprising:
at least one die laterally encapsulated by an encapsulant;
a bonding film located on a first side of the encapsulant, wherein the bonding film includes a first alignment mark structure;
a semiconductor material block located on the bonding film; and
an interconnect structure located on a second side of the encapsulant opposite to the first side, wherein the interconnect structure includes a seal ring structure and a second alignment mark structure located beside the seal ring structure, and a location of the first alignment mark structure vertically corresponds to a location of the second alignment mark structure.
|