US 12,074,131 B2
Package structure and manufacturing method thereof
Ming-Fa Chen, Taichung (TW); Hsien-Wei Chen, Hsinchu (TW); Jie Chen, New Taipei (TW); Sen-Bor Jan, Tainan (TW); and Sung-Feng Yeh, Taipei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 20, 2022, as Appl. No. 17/724,506.
Application 17/724,506 is a continuation of application No. 16/877,512, filed on May 19, 2020, granted, now 11,342,297.
Claims priority of provisional application 62/906,751, filed on Sep. 27, 2019.
Prior Publication US 2022/0246573 A1, Aug. 4, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. H01L 23/544 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01)
CPC H01L 24/29 (2013.01) [H01L 21/56 (2013.01); H01L 21/78 (2013.01); H01L 23/3157 (2013.01); H01L 23/544 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 2223/54426 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
at least one die laterally encapsulated by an encapsulant;
a bonding film located on a first side of the encapsulant, wherein the bonding film includes a first alignment mark structure;
a semiconductor material block located on the bonding film; and
an interconnect structure located on a second side of the encapsulant opposite to the first side, wherein the interconnect structure includes a seal ring structure and a second alignment mark structure located beside the seal ring structure, and a location of the first alignment mark structure vertically corresponds to a location of the second alignment mark structure.