US 12,074,124 B2
Integrated circuit package with integrated waveguide launcher
Abdellatif Zanati, Hamburg (DE); Adrianus Buijsman, Nijmegen (NL); and Dominik Xaver Simon, Munich (DE)
Assigned to NXP B.V., Eindhoven (NL)
Filed by NXP B.V., Eindhoven (NL)
Filed on Dec. 7, 2021, as Appl. No. 17/643,056.
Claims priority of application No. 20214555 (EP), filed on Dec. 16, 2020.
Prior Publication US 2022/0189894 A1, Jun. 16, 2022
Int. Cl. H01L 23/66 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01Q 9/04 (2006.01); H05K 1/02 (2006.01)
CPC H01L 23/66 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49811 (2013.01); H01L 23/49822 (2013.01); H01L 23/552 (2013.01); H01Q 9/0407 (2013.01); H05K 1/0237 (2013.01); H01L 2223/6627 (2013.01); H05K 2201/10098 (2013.01)] 17 Claims
OG exemplary drawing
 
1. An integrated circuit package comprising:
an encapsulant;
a semiconductor die in the encapsulant, the semiconductor die comprising a plurality of die terminals;
an integrated waveguide launcher, wherein the integrated waveguide launcher is connected to one of the die terminals; and
a land grid array provided on a bottom surface of the package, the land grid array comprising:
a plurality of package terminals, each package terminal configured to be soldered to a connection;
a metal pad substantially surrounded by the plurality of package terminals; and
an opening formed in the metal pad, wherein the opening is aligned with the integrated waveguide launcher.