US 12,074,120 B2
Electric component with pad for a bump and manufacturing method thereof
Robert Felix Bywalez, Munich (DE); Ute Steinhaeusser, Munich (DE); and Monika Schmiedgen, Olching (DE)
Assigned to RF360 Singapore Pte. Ltd., Singapore (SG)
Appl. No. 17/620,644
Filed by RF360 SINGAPORE PTE. LTD., Republic Plaza (SG)
PCT Filed Jun. 9, 2020, PCT No. PCT/EP2020/065898
§ 371(c)(1), (2) Date Dec. 17, 2021,
PCT Pub. No. WO2020/260005, PCT Pub. Date Dec. 30, 2020.
Claims priority of application No. 10 2019 117 214.4 (DE), filed on Jun. 26, 2019.
Prior Publication US 2022/0246546 A1, Aug. 4, 2022
Int. Cl. H01L 21/48 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/564 (2013.01) [H01L 21/4846 (2013.01); H01L 23/49894 (2013.01); H01L 23/49811 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A bump pad enclosure, comprising:
an electrode pad having an electrode pad center surface and a first perimeter area on a surface of the electrode pad, wherein the first perimeter area surrounds the electrode pad center surface;
an under bump metallization on or above the electrode pad center surface;
a first shield configured to shield the first perimeter area from a detrimental influence of an environment, wherein the first shield covers at least the first perimeter area of the electrode pad; and
a covering element formed on the first shield, wherein the first shield is positioned between the first perimeter area and the covering element, and wherein the first shield is positioned between the electrode pad and the covering element.