US 12,074,116 B2
Integrated package structure
Yaojian Lin, Wuxi (CN); Haitao Shi, Wuxi (CN); Xueqing Chen, Wuxi (CN); Jian Chen, Wuxi (CN); Shasha Zhou, Wuxi (CN); and Shuo Liu, Wuxi (CN)
Assigned to JCET GROUP CO., LTD., Wuxi (CN)
Appl. No. 17/613,057
Filed by JCET GROUP CO., LTD., Wuxi (CN)
PCT Filed May 25, 2020, PCT No. PCT/CN2020/092034
§ 371(c)(1), (2) Date Nov. 20, 2021,
PCT Pub. No. WO2021/057055, PCT Pub. Date Apr. 1, 2021.
Claims priority of application No. 201910909470.2 (CN), filed on Sep. 25, 2019.
Prior Publication US 2022/0223541 A1, Jul. 14, 2022
Int. Cl. H01L 23/52 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/552 (2006.01); H01L 25/18 (2023.01)
CPC H01L 23/552 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49822 (2013.01); H01L 25/18 (2013.01); H01L 23/49816 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An integrated package structure, comprising:
a main substrate;
a first module;
a second module;
a cavity element;
a large-size device; and
a plastic package layer covering a first surface of the main substrate and encapsulating the first module, the second module, the cavity element and the large-size device;
wherein the main substrate comprises the first surface of the main substrate and a second surface of the main substrate opposite to each other; the first module and the second module are stacked; and the first module and the second module which are stacked, the cavity element and the large-size device are horizontally arranged on the first surface of the main substrate, and are respectively electrically connected to the main substrate;
wherein the plastic package layer comprises a first surface of the plastic package layer distal from the main substrate and a second surface of the plastic package layer proximal to the main substrate; and the first surface of the plastic package layer is provided with an opening groove extending towards the cavity element and at least partially facing the cavity element.