US 12,074,112 B2
Package structure
Chin-Chuan Chang, Zhudong Township (TW); and Szu-Wei Lu, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Apr. 26, 2023, as Appl. No. 18/307,114.
Application 17/400,731 is a division of application No. 16/548,202, filed on Aug. 22, 2019, granted, now 11,094,635, issued on Aug. 17, 2021.
Application 18/307,114 is a continuation of application No. 17/400,731, filed on Aug. 12, 2021, granted, now 11,670,597.
Prior Publication US 2023/0260918 A1, Aug. 17, 2023
Int. Cl. H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01)
CPC H01L 23/5386 (2013.01) [H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 21/486 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 21/78 (2013.01); H01L 23/3128 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 24/16 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 2221/68372 (2013.01); H01L 2224/16225 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19103 (2013.01); H01L 2924/19105 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A package structure, comprising:
a first redistribution structure;
an interposer over the first redistribution structure and comprising:
a through via electrically connected to the first redistribution structure;
a conductive pillar over the through via;
a passivation layer surrounding a bottom surface of the conductive pillar; and
a polymer layer surrounding a top surface of the conductive pillar;
a first molding compound layer surrounding the interposer;
a second redistribution structure over the first molding compound layer and in contact with the polymer layer and electrically connected to the conductive pillar; and
a semiconductor die over and electrically connected to the second redistribution structure.