CPC H01L 23/49562 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49555 (2013.01); H01L 23/49805 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H05K 3/3426 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/14 (2013.01)] | 21 Claims |
1. A method, comprising:
forming a package structure to enclose portions of a first lead and a second lead, the package structure including opposite first and second sides spaced apart from one another along a first direction, and opposite third and fourth sides spaced apart from one another along a second direction orthogonal to the first direction;
bending the first lead downward toward a plane of the first side and away from a plane of the second side; and
bending the second lead upward toward the plane of the second side and away from the plane of the first side, wherein the first lead and the second lead are on a same side of the package structure.
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