US 12,074,098 B2
Three-dimensional functional integration
Sreenivasan K. Koduri, Dallas, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Apr. 27, 2023, as Appl. No. 18/308,648.
Application 18/308,648 is a division of application No. 16/457,941, filed on Jun. 29, 2019, granted, now 11,682,609.
Prior Publication US 2023/0260879 A1, Aug. 17, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H05K 3/34 (2006.01)
CPC H01L 23/49562 (2013.01) [H01L 23/3107 (2013.01); H01L 23/49555 (2013.01); H01L 23/49805 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H05K 3/3426 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/14 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A method, comprising:
forming a package structure to enclose portions of a first lead and a second lead, the package structure including opposite first and second sides spaced apart from one another along a first direction, and opposite third and fourth sides spaced apart from one another along a second direction orthogonal to the first direction;
bending the first lead downward toward a plane of the first side and away from a plane of the second side; and
bending the second lead upward toward the plane of the second side and away from the plane of the first side, wherein the first lead and the second lead are on a same side of the package structure.