US 12,074,096 B2
Die attach surface copper layer with protective layer for microelectronic devices
Christopher Daniel Manack, Flower Mound, TX (US); Nazila Dadvand, Richardson, TX (US); and Salvatore Pavone, Murphy, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by Texas Instruments Incorporated, Dallas, TX (US)
Filed on Feb. 18, 2020, as Appl. No. 16/793,887.
Application 16/793,887 is a continuation of application No. 15/984,343, filed on May 19, 2018, granted, now 10,566,267.
Claims priority of provisional application 62/568,463, filed on Oct. 5, 2017.
Prior Publication US 2020/0185309 A1, Jun. 11, 2020
Int. Cl. H01L 23/495 (2006.01); H01L 21/683 (2006.01); H01L 23/00 (2006.01); H01L 23/36 (2006.01); H01L 23/49 (2006.01); H01L 23/492 (2006.01); H01L 23/532 (2006.01)
CPC H01L 23/49517 (2013.01) [H01L 23/49 (2013.01); H01L 23/492 (2013.01); H01L 23/49513 (2013.01); H01L 23/49524 (2013.01); H01L 23/49562 (2013.01); H01L 23/53238 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04026 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/05171 (2013.01); H01L 2224/05568 (2013.01); H01L 2224/05647 (2013.01); H01L 2224/13007 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/131 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/291 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/81815 (2013.01); H01L 2224/92247 (2013.01); H01L 2224/94 (2013.01)] 12 Claims
OG exemplary drawing
 
1. A microelectronic device, comprising:
a substrate having a component surface and a die attach surface located opposite from the component surface;
a wire bond attached to the component surface;
a copper containing layer on the die attach surface, wherein the copper containing layer occupies more than 50% surface area of the die attach surface; and
a die attach material on the copper containing layer, wherein the copper containing layer is attached to a portion of a lead frame by the die attach material, wherein the copper containing layer is recessed from a lateral perimeter of the die attach surface in its entirety from a bottom view of the microelectronics device.