CPC H01L 23/49503 (2013.01) [H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/53214 (2013.01); H01L 24/93 (2013.01)] | 18 Claims |
1. A method, comprising:
positioning a semiconductor die over a first end of an orifice extending through a substrate having one or more conductive layers including an exposed conductive layer at a surface of the substrate;
applying a suction to a second end of the orifice opposing the first end to hold the semiconductor die in place;
coupling the semiconductor die to the exposed conductive layer at the surface using bond wires; and
causing the semiconductor die to elevate above the surface by ceasing to apply the suction.
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