US 12,074,095 B2
Suspended semiconductor dies
Barry Jon Male, West Granby, CT (US); and Marco Corsi, Scotts Valley, CA (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Nov. 4, 2022, as Appl. No. 18/052,643.
Application 18/052,643 is a division of application No. 17/120,941, filed on Dec. 14, 2020, granted, now 11,495,522.
Prior Publication US 2023/0089201 A1, Mar. 23, 2023
Int. Cl. H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01)
CPC H01L 23/49503 (2013.01) [H01L 23/49531 (2013.01); H01L 23/49541 (2013.01); H01L 23/53214 (2013.01); H01L 24/93 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method, comprising:
positioning a semiconductor die over a first end of an orifice extending through a substrate having one or more conductive layers including an exposed conductive layer at a surface of the substrate;
applying a suction to a second end of the orifice opposing the first end to hold the semiconductor die in place;
coupling the semiconductor die to the exposed conductive layer at the surface using bond wires; and
causing the semiconductor die to elevate above the surface by ceasing to apply the suction.