CPC H01L 23/3675 (2013.01) [H01L 23/31 (2013.01); H02M 7/003 (2013.01); H01L 2924/181 (2013.01)] | 4 Claims |
1. A semiconductor module comprising:
a heat dissipation member having a first surface; and
a semiconductor device disposed on the first surface and having a surface portion facing the heat dissipation member; wherein
a partial surface of the first surface of the heat dissipation member and a partial region of the surface portion of the semiconductor device are connected by a thermally conductive insulating resin sheet,
the first surface of the heat dissipation member has a flat surface portion outward of the partial surface, the flat surface portion being continuous with and flush with the partial surface,
the semiconductor device includes
a semiconductor element,
a metal wiring member electrically connected to the semiconductor element and including a terminal portion protruding outside the semiconductor device, and
a heat spreader having an exposed surface exposed at the surface portion of the semiconductor device,
the partial region includes the exposed surface,
in the surface portion of the semiconductor device, a concave portion is formed outward of the partial region to which the thermally conductive insulating resin sheet is connected,
the concave portion is provided to face the flat surface portion of the heat dissipation member,
the surface portion of the semiconductor device located outward of the partial region and inward of the concave portion is spaced apart from the flat surface portion of the heat dissipation member, and an inside of the concave portion is exposed,
the concave portion is located in a region closer to the heat dissipation member than the terminal portion, and
the concave portion has a depth smaller than a thickness of the thermally conductive insulating resin sheet.
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