US 12,074,081 B2
Use of bimetals in a heat sink to benefit heat transfer from high temperature integrated circuit components on a circuit board
Madeline Marie Roemer, Los Altos, CA (US); Mahesh Daisy, Folsom, CA (US); and Jerome Henry, Pittsboro, NC (US)
Assigned to CISCO TECHNOLOGY, INC., San Jose, CA (US)
Filed by Cisco Technology, Inc., San Jose, CA (US)
Filed on May 28, 2021, as Appl. No. 17/333,642.
Prior Publication US 2022/0384301 A1, Dec. 1, 2022
Int. Cl. H01L 23/367 (2006.01); H01L 23/373 (2006.01); H05K 1/02 (2006.01)
CPC H01L 23/3675 (2013.01) [H01L 23/3735 (2013.01); H05K 1/0209 (2013.01); H05K 2201/066 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a printed circuit board (PCB);
an integrated circuit (IC) component connected with a surface of the PCB; and a heat sink, the heat sink comprising:
a base plate disposed directly over the IC component;
a plurality of cooling fins extending transversely from the base plate; and
a diverter that extends along the PCB and is oriented along one side of the IC component so as to control a direction of a flow of air toward the cooling fins;
wherein: the heat sink includes at least one component comprising a bimetallic material that bends away from the base plate when heated above a threshold temperature so as to increase the flow of air directed toward and contacting the cooling fins or maintaining contact between a surface of the IC component and a facing surface of the base plate.