US 12,074,078 B2
Laminate, film forming method, and film forming apparatus
Hiroshi Hashigami, Annaka (JP); and Takenori Watabe, Annaka (JP)
Assigned to SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
Appl. No. 17/414,073
Filed by SHIN-ETSU CHEMICAL CO., LTD., Tokyo (JP)
PCT Filed Nov. 18, 2019, PCT No. PCT/JP2019/045034
§ 371(c)(1), (2) Date Jun. 15, 2021,
PCT Pub. No. WO2020/129508, PCT Pub. Date Jun. 25, 2020.
Claims priority of application No. 2018-236960 (JP), filed on Dec. 19, 2018.
Prior Publication US 2022/0059424 A1, Feb. 24, 2022
Int. Cl. H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 23/29 (2006.01)
CPC H01L 23/3171 (2013.01) [H01L 21/56 (2013.01); H01L 23/291 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A film forming method comprising the steps of:
forming a mixture gas containing at least an atomized metal oxide precursor, a carrier gas, and a dopant;
conveying the mixture gas to a film-forming unit via a conveyor; and
forming a semiconductor film on a substrate by subjecting the mixture gas to a thermal reaction in the film-forming unit,
wherein:
at least a surface in the conveyor that comes into contact with the mixture gas is a non-silicone resin, and
the non-silicone resin contains any one or more of polyethylene, polypropylene, vinyl chloride, polystyrene, polyvinyl acetate, urethane resin, acrylonitrile-butadiene-styrene resin, acrylic resin, polyamide, polyimide, polyamide imide, nylon, acetal resin, polycarbonate, polyphenylene ether, polyester, polyethylene terephthalate, polybutylene terephthalate, polyolefin, polyphenylene sulfide, polysulfone, polyether sulfone, polyarylate, and polyether ether ketone.