US 12,074,072 B2
Semiconductor manufacturing equipment and semiconductor manufacturing method
Hiroshi Tanaka, Tokyo (JP)
Assigned to Mitsubishi Electric Corporation, Tokyo (JP)
Filed by Mitsubishi Electric Corporation, Tokyo (JP)
Filed on Apr. 20, 2021, as Appl. No. 17/235,053.
Application 17/235,053 is a division of application No. 16/461,995, granted, now 11,069,582, previously published as PCT/JP2016/088158, filed on Dec. 21, 2016.
Prior Publication US 2021/0242095 A1, Aug. 5, 2021
Int. Cl. H01L 21/66 (2006.01); G01B 3/00 (2006.01); H01L 21/67 (2006.01)
CPC H01L 22/12 (2013.01) [G01B 3/004 (2013.01); H01L 21/67253 (2013.01)] 16 Claims
OG exemplary drawing
 
1. Semiconductor manufacturing equipment configured to perform processing for manufacturing a semiconductor on a wafer, the semiconductor manufacturing equipment comprising
a thickness calculation function,
the thickness calculation function including
a measurement value acquisition unit configured to acquire a plurality of measurement values at different measurement positions of the wafer from a thickness measurement function configured to measure a thickness of the wafer or a thickness measurement object deposited on the wafer along a surface of the wafer,
a histogram data creation unit configured to create histogram data based on the plurality of measurement values, and
a grade group extraction unit configured to extract a grade group from the histogram data,
the grade group including sequential grades having frequencies equal to or greater than a predetermined frequency,
the thickness calculation function further including a representative value calculation unit configured to calculate a representative value of a thickness of a measurement region based on the grades included in the extracted grade group.